pb rohs eccm9ja20-14.31818m eccm9 j a 20 -14.31818m series rohs compliant (pb-free) 3.2mm x 5mm ceramic smd crystal frequency tolerance/stability 15ppm at 25c, 30ppm over -40c to +85c mode of operation at-cut fundamental nominal frequency 14.31818mhz load capacitance 20pf parallel resonant electrical specifications nominal frequency 14.31818mhz frequency tolerance/stability 15ppm at 25c, 30ppm over -40c to +85c aging at 25c 3ppm/year maximum load capacitance 20pf parallel resonant shunt capacitance (c0) 7pf maximum equivalent series resistance 70 ohms maximum mode of operation at-cut fundamental drive level 100watts maximum, 10watts correlation crystal cut at-cut spurious response >3db from fo to fo+5000ppm storage temperature range -40c to +125c insulation resistance 500 megaohms minimum at 100vdc environmental & mechanical specifications esd susceptibility mil-std-883, method 3015, class 1, hbm: 1500v fine leak test mil-std-883, method 1014, condition a flammability ul94-v0 gross leak test mil-std-883, method 1014, condition c mechanical shock mil-std-883, method 2002, condition b moisture resistance mil-std-883, method 1004 moisture sensitivity j-std-020, msl 1 resistance to soldering heat mil-std-202, method 210, condition k resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010, condition b vibration mil-std-883, method 2007, condition a mechanical dimensions (all dimensions in millimeters) pin connection 1 crystal 2 cover/ground 3 crystal 4 cover/ground line marking 1 e14.31 e=ecliptek 2 xxxxx xxxxx=ecliptek manufacturing identifier www.ecliptek.com | specification subject to change without notice | rev h 8/13/2010 | page 1 of 4 3 2 1 4 marking orient a tion 2 3 4 1 3.2 0.2 5.0 0.2 1.0 max 2.6 0.1 1.4 0.1 1.2 0.1 (x4) 0.9 0.1 (x4) note: chamf er not sho wn.
eccm9ja20-14.31818m 2.3 1.0 1.2 (x4) 1.5 (x4) www.ecliptek.com | specification subject to change without notice | rev h 8/13/2010 | page 2 of 4 all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eccm9ja20-14.31818m high temperature infrared/convection ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev h 8/13/2010 | page 3 of 4
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eccm9ja20-14.31818m low temperature infrared/convection 240c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 60 - 120 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 240c maximum target peak temperature (tp target) 240c maximum 1 time / 230c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times / 80 seconds maximum 1 time ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev h 8/13/2010 | page 4 of 4
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